Implementation of Fully Coupled Electromigration Theory in COMSOL
Author:
Affiliation:
1. Delft University of Technology,Department of Microelectronics,Delft,Netherlands,2628 CD
2. Lamar University,Department of Mechanical Engineering,Beaumont,TX,USA,77710
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816390.pdf?arnumber=9816390
Reference29 articles.
1. Design and optimization of thermo-mechanical reliability in wafer level packaging
2. Finite element modeling on electromigration of solder joints in wafer level packages
3. Electromigration simulation of flip chip CSP LED
4. Does current crowding induce vacancy concentration singularity in electromigration?
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