Author:
Taner Ozgur,Kijkanjanapaiboon Kasemsak,Fan Xuejun
Cited by
4 articles.
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1. Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Effect of Thermomigration on Electromigration in SWEAT Structures;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
3. Implementation of Fully Coupled Electromigration Theory in COMSOL;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
4. An observation and explanation of interior cracking at the interface of solder by electromigration;Microelectronics Reliability;2019-06