High Temperature Die Interconnection Approaches-Reference-Cited by-同舟云学术

High Temperature Die Interconnection Approaches

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Alshatnawi Firas¹,Alhendi Mohammed¹,Al-Haidari Riadh A.¹,Sivasubramony Rajesh S.¹,Abbara El Mehdi¹,Udara Somarathna K¹,Poliks Mark D.¹,Borgesen Peter¹,Shaddock David M.²,Stoffel Nancy²,Hoel Cathleen²

Affiliation:

1. Binghamton University,Center for Advanced Microelectronics Manufacturing (CAMM),Department of Systems Science and Industrial Engineering,Binghamton,NY,USA,13902

2. GE Research Center,Niskayuna,NY,USA,12309

Funder

Air Force Research Laboratory

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816389.pdf?arnumber=9816389

Reference20 articles.

1. A12O3 and AlN Ceramic Chip-level Packages for 500oC Operation;chen;6th International Conference on High Temperature Electronics (HITEN,2005

2. Evaluation of Thick-Film Materials for High-Temperature Packaging

3. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits

4. Characterization of Thick Film Technology for 300°C Packaging

5. 3D printing of ceramics: A review

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High stability and reliability additively manufactured metal-insulator-metal capacitors for high-temperature applications;Materials Today Communications;2024-06

2. Modeling and Additive Manufacturing of Inductors in Complex Geometries for High Temperature Electronics;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Embedded RF Packaging Via Ceramic 3D Printing and Printed Electronics Additive Manufacturing;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Novel SiO₂ Cables With Edge Launch Connectors for High Temperature RF Measurements;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. Guidelines and Experimental Hydraulic performance Evaluation for Single-Phase CDUs Under Steady and Transient Events;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30