Embedded RF Packaging Via Ceramic 3D Printing and Printed Electronics Additive Manufacturing-Reference-Cited by-同舟云学术

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Embedded RF Packaging Via Ceramic 3D Printing and Printed Electronics Additive Manufacturing

Published:2024-05-28 Issue: Volume:122 Page:685-692
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
language:
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Author:

Obeidat Abdullah S.¹,Umar Ashraf¹,Dou Zhi¹,Alshatnawi Firas¹,Al-Haidari Riadh¹,Al-Shaibani Waleed¹,Alhendi Mohammed¹,Abdelatty Mohamed Y.¹,Boyd Linda²,Hoel Cathleen²,Valle Angulo Genaro Soto²,Budka Thomas²,Case Jason²,Iannotti Joseph²,Pavinatto Felippe²,Poliks Mark D.¹

Affiliation:

1. The State University of New York,Binghamton,NY,USA

2. GE Aerospace Research,Niskayuna,NY,USA

Funder

Air Force Research Laboratory

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564868.pdf?arnumber=10564868

Reference20 articles.

1. Hybrid additive manufacturing of 3D electronic systems

2. Additive manufacturing frontier: 3D printing electronics

3. Embedded RF passives technology using a combination of multilayer organic package substrate and silicon-based integrated passive devices

4. Ceramic Substrates for High-temperature Electronic Integration

5. High Temperature Die Interconnection Approaches

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