Pressure-assist Silver Sintering Paste for SiC Power Device Attachment on Lead Frame Based Package-Reference-Cited by-同舟云学术

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Pressure-assist Silver Sintering Paste for SiC Power Device Attachment on Lead Frame Based Package

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Wai Leong Ching¹,Yamamoto Kazunori²,Tang Gongyue²,Soh Jacob Jordon¹

Affiliation:

1. Heterogeneous Integration Institute of Microelectronics,Singapore

2. Institute of Microelectronics,System In Package,Singapore

Funder

Science and Engineering Research Council

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816581.pdf?arnumber=9816581

Reference10 articles.

1. Packaging Technology for Electronic Applications in Harsh High-Temperature Environments

2. Novel Silicon Carbide Integrated Power Module for EV application

3. Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module

4. Pressureless Silver Sintering of Silicon-Carbide Power Modules for Electric Vehicles

5. Facile Preparation of Cu-Ag Micro-Nano Composite Pasate for High Power Device Packaging;liu;2020 IEEE 70th Electronic Components and Technology Conference (ECTC,0

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