Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module-Reference-Cited by-同舟云学术

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Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Tang Gongyue,Wai Leong Ching,Lim Siak Boon,Ye Yong Liang,Lau Boon Long,Yamamoto Kazunori,Zhang Xiaowu

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501764.pdf?arnumber=9501764

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Double-Sided Cooled SiC MOSFET Power Module for EV Inverters;IEEE Transactions on Power Electronics;2024-09

2. Bare copper bonding with facilely synthesized Ag nanoparticles decorated Cu microparticles paste;Journal of Materials Science: Materials in Electronics;2024-08

3. Review on Power Cycling Reliability of SiC Power Device;Electronic Materials;2024-06-10

4. A Double-Sided Cooled Power Module With Embedded Decoupling Capacitors;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-04

5. Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03

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