Advanced Fanout Packaging Technology for Hybrid Substrate Integration-Reference-Cited by-同舟云学术

Advanced Fanout Packaging Technology for Hybrid Substrate Integration

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Cao Lihong¹,Lee Teck Chong²,Chen Rick²,Chang Yung-Shun²,Lu Hsingfu²,Chao Nicholas²,Huang Yen-Liang²,Wang Chen-Chao²,Huang Chih-Yi²,Kuo Hung-Chun²,Wu YiHsien²,Cheng Hung-Hsiang²

Affiliation:

1. Advanced Semiconductor Engineering, (U.S.) Inc.,Engineering & Technical Promotion,Austin,TX,USA,78704

2. Advanced Semiconductor Engineering, Inc.,Corporate R&D Center,Kaohsiung,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816673.pdf?arnumber=9816673

Reference6 articles.

1. An Ultra Low Loss SerDes Signal Design on a FC Package Applied in 56 Gbps Networks

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3. Package warpage measurement of surface-mount integrated circuits at elevated temperature;JESD22-B112,2009

4. An Efficient and Fast 112Gbps/PAM4 Signal Line Design with Conventional FCBGA Substrate Based on a 3-D Component Library

5. 3D Multi-chip Integration with System on Integrated Chips (SoIC™)

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