An Efficient and Fast 112Gbps/PAM4 Signal Line Design with Conventional FCBGA Substrate Based on a 3-D Component Library
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Advanced Fanout Packaging Technology for Hybrid Substrate Integration;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05