Effect of Underfill Property Evolution on Solder Joint Reliability in Automotive Applications
Author:
Affiliation:
1. Auburn University,NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,36849
Funder
Semiconductor Research Corporation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816558.pdf?arnumber=9816558
Reference26 articles.
1. Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year
2. Modeling of Effect of Underfill Properties on Flip Chip Bumps and Solder Balls of FCBGA Package in Automotive Underhood Applications
3. Board level solder reliability vs. ramp rate & dwell time during temperature cycling
4. Effects of dwell time and ramp rate on lead-free solder joints in FCBGA packages;fan;ECTC'05,2005
5. Study on Factors Affecting Underfill Flow and Underfill Voids in a Large-die Flip Chip Ball Grid Array (FCBGA) Package
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