登录 注册 会员服务 联系我们

Influence of Prepreg Material Properties on Printed Circuit Board (PCB) Stack-up

  • Published:2022-05 Issue: Volume: Page:
  • ISSN:
  • Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • language:
  • Short-container-title:

Author:

Liu Tomin1,Devarajan Mutharasu1

Affiliation:

1. Material Centre of Excellence (MCOE),PTDI Western Digital,Batu Kawan,Malaysia

Publisher

IEEE

Reference9 articles.

1. Reliable plated through-via design and fabrication;tulkoff;SMTA International,2013

2. Effect of lead-free soldering on key material properties of FR-4 printed circuit board laminates

3. Multi-faceted approach to minimize printed circuit board warpage in board assembly process;aravamudhan;SMTA International,2016

4. Understanding Glass Fabric,0

5. Akrometrix optical techniques and analyses 101;30-50SW-0101 Ver 8 5,0
同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3