Determination of the glass transition temperature of electrotechnical prepregs by differential scanning calorimetry (DSC)

Author:

Karezin Konstantin I.1,Popova Ekaterina I.1,Nevskiy Roman E.1,Sokovishin Alexey V.1

Affiliation:

1. Dukhov Automatics Research Institute (FSUE VNIIA)

Publisher

TEST-ZL Publishing

Reference18 articles.

1. Xie C., Zou H., Wei-Yao., Wang M. Research on reliability of non-flow prepreg filling in automotive R-F PCB / 16th International microsystems, packaging, assembly and circuits technology conference (IMPACT). — Taipei, Taiwan, 2021. P. 82 – 85. DOI: 10.1109/IMPACT53160.2021.9697053

2. Liu T., Devarajan M. Influence of prepreg material properties on printed circuit board stack-up / 72nd electronic components and technology conference (ECTC). IEEE. — San Diego, CA, USA, 2022. P. 2244 – 2248. DOI: 10.1109/ECTC51906.2022.00354

3. Borozdina E. A. Methods of testing the adhesive gasket used for manufacture of multilayer printed circuit boards. http:// www.dnevnikinauki.ru/images/publications/2023/11/technics/Borozdina.pdf (accessed 17.05.2024) [in Russian].

4. Shimkin A. A., Safronov A. M. Quality control of polymer binders by DSC / Industr. Lab. Mater. Diagn. 2016. Vol. 82. N 8. P. 30 – 33 [in Russian].

5. Shimkin A. A., Grebneva T. A., Merkulova Yu. I. Determination of degree of cure of thermosetting resins using IR-spectroscopy and differential scanning calorimetry / Industr. Lab. Mater. Diagn. 2017. Vol. 83. N 8. P. 27 – 32 [in Russian].

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