Simulation of the Filler Stuck Mechanism in Molding Process and Verification

Author:

Chien Tzu Chieh1,Lo Shih Kun1,Kuo Yen Hua1,Liu Hui Chung1,Li Zong Yuan1,Lin Yi Nong1,Lai Lu Ming1,Chen Kuang Hsiung1

Affiliation:

1. ASE Group,Central Development Engineering(CDE),Taoyuan,Taiwan

Publisher

IEEE

Reference25 articles.

1. Effect of filler concentration of rubbery shear and bulk modulus of molding compounds, Microelectron;yang;Reliability,2007

2. High filler loading technique and its effects on the reliability of epoxy molding compound

3. Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

4. 3D simulation of filler concentration in semiconductor processing

5. Rheology of gas–solid fluidized bed, Fuel Process;zhao;Technol,2000

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1. The Phenomenon of Tunnel Structure Mold Flowability Experiment Result and Simulation Study;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Optimization of Process Parameters for Molding Simulation of Open Cavity QFN;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

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