Damage Evolution of Double-Sided Copper Conductor on Multi-layer Flexible Substrate Under Bending-Reference-Cited by-同舟云学术

Damage Evolution of Double-Sided Copper Conductor on Multi-layer Flexible Substrate Under Bending

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Chen Rui¹,Chow Justin¹,Sitaraman Suresh K.¹

Affiliation:

1. Georgia Institute of Technology,Computer-Aided Simulation of Packaging Reliability (CASPaR) Labrotary George W. Woodruff School of Mechanical Engineering,Atlanta,GA,30332

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816430.pdf?arnumber=9816430

Reference25 articles.

1. Bending Fatigue Study of Sputtered ITO on Flexible Substrate

2. Bending Setups for Reliability Investigation of Flexible Electronics

3. Bending Strain and Bending Fatigue Lifetime of Flexible Metal Electrodes on Polymer Substrates

4. Multi-Physics Modeling and Characterization of Components on Flexible Substrates

5. Theoretical and Experimental Studies of Bending of Inorganic Electronic Materials on Plastic Substrates

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