Abstract
Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Reference105 articles.
1. Handbook of Flexible Organic Electronics;Logothetidis,2015
2. Ultra-thin chips for high-performance flexible electronics
3. Flexible Electronics: The Next Ubiquitous Platform
4. Flexible Hybrid Electronics: Review and Challenges;Tong;Proc. IEEE Int. Symp. Circuits Syst.,2018
Cited by
44 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献