Fully Integrated Single-Chip 305–375-GHz Transceiver With On-Chip Antennas in SiGe BiCMOS-Reference-Cited by-同舟云学术

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Fully Integrated Single-Chip 305–375-GHz Transceiver With On-Chip Antennas in SiGe BiCMOS

Published:2018-05 Issue:3 Volume:8 Page:329-339
ISSN:2156-342X
Container-title:IEEE Transactions on Terahertz Science and Technology
language:
Short-container-title:IEEE Trans. THz Sci. Technol.

Author:

Al-Eryani Jidan^ORCID,Knapp Herbert^ORCID,Kammerer Jonas^ORCID,Aufinger Klaus^ORCID,Li Hao,Maurer Linus^ORCID

Funder

European Commission

DOTSEVEN

REFERENCE

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Radiation

Link

http://xplorestaging.ieee.org/ielx7/5503871/8353206/08340871.pdf?arnumber=8340871

Cited by 59 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A 0.68-THz Receiver With Third-Order Subharmonic Mixing in 65-nm CMOS;IEEE Journal of Solid-State Circuits;2024-08

2. A 360 GHz Fully Integrated Differential Signal Source With 106.7 GHz Continuous Tuning Range in 90 nm SiGe:C BiCMOS;IEEE Transactions on Microwave Theory and Techniques;2024-08

3. A 335–407-GHz SiGe-Based Subharmonic Mixer Using a Fully Integrated LO Generation;IEEE Microwave and Wireless Technology Letters;2024-06

4. Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-05

5. High-Gain and High-Efficiency Sub-Terahertz Antenna-on-Chip With Microbumps for Highly-Integrated Systems;IEEE Transactions on Antennas and Propagation;2024-05

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