Affiliation:
1. Université catholique de Louvain, Louvain-la-Neuve, Belgium
Funder
Ecsel JU Project “Beyond5” via EU H2020 and Innoviris (Brussels/Belgium) funding
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
1 articles.
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1. Research on the Latch-Up Mechanism of DSOI at High Temperature;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14