Improved Performance of MoS2 Negative-Capacitance Transistors by Using Hf1-x Al x O y as Gate Dielectric Plus NH3-Plasma Treatment
Author:
Affiliation:
1. School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China
Funder
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/16/10227840/10192523.pdf?arnumber=10192523
Reference33 articles.
1. Thermal stability of ultrathin ZrO2 films prepared by chemical vapor deposition on Si(100)
2. Ferroelectricity in hafnium oxide thin films
3. Characterization of Al Incorporation into HfO2 Dielectric by Atomic Layer Deposition
4. Reduction of Electrical Defects in Atomic Layer Deposited HfO2 Films by Al Doping
5. Charge-Trapping Phenomena in HfO2-Based FeFET-Type Nonvolatile Memories
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