Affiliation:
1. IBM Research, Albany, USA
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Reference33 articles.
1. First-principles evaluation of FCC ruthenium for its use in advanced interconnects;philip;Phys Rev A Gen Phys,2020
2. Process development of replacement metal gate Tungsten chemical mechanical polishing on 14nm technology node and beyond
3. A First-Principles Density Functional Theory Based Framework for Barrier Material Screening
4. Ruthenium metallization for advanced interconnects
5. Mechanical properties of solid bulk materials and thin films;richter;A Lecture Series for the Teaching Program of the International Research Training Group,2010