Chip Package Interaction (CPI) risk assessment of 22FDX® Wafer Level Chip Scale Package (WLCSP) using 2D Finite Element Analysis modeling-Reference-Cited by-同舟云学术

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Chip Package Interaction (CPI) risk assessment of 22FDX® Wafer Level Chip Scale Package (WLCSP) using 2D Finite Element Analysis modeling

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Machani Kashi Vishwanath,Kuechenmeister Frank,Breuer Dirk,Klewer Christian,Cho Jae Kyu,Young-Fisher Kristina

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159493.pdf?arnumber=9159493

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fan-In Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

2. Chip-Package Interaction: A Case Study Applied To A Mature Technology Node;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. An RDL Modeling and Thermo-Mechanical Simulation Method of 2.5D/3D Advanced Package Considering the Layout Impact Based on Machine Learning;Micromachines;2023-07-30

4. Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03

5. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

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