A New RDL-First PoP Fan-Out Wafer-Level Package Process with Chip-to-Wafer Bonding Technology

Author:

Son SeungNam,Khim DongHyun,Yun SeokHun,Park JunHwan,Jeong EunTaek,Yi JiHun,Yoo JinKun,Yang KiYeul,Yi MinJae,Lee SangHyoun,Do WonChul,Khim JinYoung

Publisher

IEEE

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Interconnection Performance of Copper Core Solder Joints in Ball-Grid-Array Package;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

3. Optimization of Temporary Carrier Technology for HDFO Packaging;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole;Polymer;2021-03

5. Fan-Out Wafer/Panel-Level Packaging;Semiconductor Advanced Packaging;2021

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