Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole-Reference-Cited by-同舟云学术

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Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole

Published:2021-03 Issue: Volume:218 Page:123514
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

Sui Yuying,Li Jinhui,Wang Tao,Sun Deliang,Huang Chao,Zhang Fan,Shan Liang,Niu Fangfang,Zhang Guoping,Sun Rong

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference37 articles.

1. Advances in polyimide-based materials for space applications;Gouzman;Adv. Mater.,2019

2. Properties OF thin polyimide films;Rothman;J. Electrochem. Soc.,1980

3. An ultra-lightweight design for imperceptible plastic electronics;Kaltenbrunner;Nature,2013

4. Polyimide/POSS nanocomposites: interfacial interaction, thermal properties and mechanical properties;Huang;Polymer,2003

5. Advanced polyimide materials: syntheses, physical properties and applications;Liaw;Prog. Polym. Sci.,2012

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1. Novel low‐temperature curable photosensitive polyimides with stable storage;Journal of Polymer Science;2024-08-23

2. 5‐aminobenzimidazole@graphene oxide nanosheets doped polyimide nanocomposites: Low‐temperature curing and improved mechanical properties;Polymer Composites;2024-07-12

3. A comprehensive study on the effect of molecular chain flexibility on the low-temperature curing ability of polyimides;Journal of Materials Chemistry C;2024

4. Improvements in properties of polybenzoxazine-based laser-induced graphene (LIG) by alloying with polyimide and modeling of production process;Nanoscale Advances;2024

5. POLYMERS AND THEIR CURATIVES;Handbook of Curatives and Crosslinkers;2024

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