Hybrid Fan-out Package for Vertical Heterogeneous Integration-Reference-Cited by-同舟云学术

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Hybrid Fan-out Package for Vertical Heterogeneous Integration

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Chuang Po-Yao,Lin M.-L.,Hung S.-T.,Wu Y.-W.,Wong D.-C.,Yew M.-C.,Hsu C.-K.,Liao L.-L,Lai P.-Y.,Tsai P.-H.,Chen S.-M.,Cheng S.-K.,Jeng Shin-Puu

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159390.pdf?arnumber=9159390

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Next Generation Large Size High Interconnect Density CoWoS-R Package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration;Applied Surface Science;2023-02

3. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

4. Hybrid Stacked-Die Package Solution for Extremely Small-Form-Factor Package;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

5. Organic Interposer CoWoS-R⁺ (plus) Technology;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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