Organic Interposer CoWoS-R+ (plus) Technology
Author:
Affiliation:
1. Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan (R.O.C.),30077
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816459.pdf?arnumber=9816459
Reference15 articles.
1. Heterogeneous Power Delivery for 7nm High-Performance Chiplet-Based Processors using Integrated Passive Device and In-Package Voltage Regulator
2. Embedded Muiti-Die Interconnect Bridge (EMIB) – A High Density, High Bandwidth Packaging Interconnect;mahajan;IEEE ECTC,2016
3. Scalable Chiplet package using Fan-Out Embedded Bridge
4. Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
5. Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management
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