Wideband characterization of a typical bonding wire for microwave and millimeter-wave integrated circuits-Reference-Cited by-同舟云学术

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Wideband characterization of a typical bonding wire for microwave and millimeter-wave integrated circuits

Published:1995 Issue:1 Volume:43 Page:63-68
ISSN:0018-9480
Container-title:IEEE Transactions on Microwave Theory and Techniques
language:
Short-container-title:IEEE Trans. Microwave Theory Techn.

Author:

Hai-Young Lee

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Link

http://xplorestaging.ieee.org/ielx1/22/8318/00363006.pdf?arnumber=363006

Cited by 47 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Low-Loss Bond-Wire Interconnect Design With More Than 130 GHz Bandwidth Enabling an Ultra-Broadband Heterogeneous System Design;IEEE Transactions on Microwave Theory and Techniques;2024-01

2. Cross-Over Wire-Bonding for Millimeter-Wave Applications;IEEE Electron Device Letters;2023-12

3. A Robust LC-π Matching Network for 112 Gb/s PAM4 Receiver in 28 nm CMOS;Electronics;2023-06-24

4. A Wire-Bonded Patch Antenna for Millimeter Wave Applications;Electronics;2023-01-27

5. Evaluation and Extraction of Equivalent Circuit Parameters for GSG-Type Bonding Wires Using Electromagnetic Simulator;IEICE Transactions on Electronics;2022-11-01

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