A Wire-Bonded Patch Antenna for Millimeter Wave Applications
Author:
Affiliation:
1. Institute of Radioelectronics and Multimedia Technology, Warsaw University of Technology, Nowowiejska 15/19, 00-665 Warsaw, Poland
2. Łukasiewicz Research Network, Tele and Radio Research Institute, Ratuszowa 11, 03-450 Warsaw, Poland
Abstract
Funder
National Science Centre
Foundation for Polish Science
Publisher
MDPI AG
Subject
Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering
Link
https://www.mdpi.com/2079-9292/12/3/632/pdf
Reference47 articles.
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2. Connecting Chips With More Than 100 GHz Bandwidth;Heinrich;IEEE J. Microw.,2021
3. Recent Advances and Trends in Advanced Packaging;Lau;IEEE Trans. Compon. Packag. Manuf. Technol.,2022
4. Millimeter-Wave Transmitter with LTCC Antenna and Silicon Lens;Bajurko;Int. J. Electron. Telecommun.,2022
5. Hebeler, J., Steinweg, L., and Zwick, T. (2022, January 27–29). Differential Bondwire Interface for Chip-to-Chip and Chip-to-Antenna Interconnect above 200 GHz. Proceedings of the 2022 52nd European Microwave Conference (EuMC), Milan, Italy.
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