A Wire-Bonded Patch Antenna for Millimeter Wave Applications-Reference-Cited by-同舟云学术

A Wire-Bonded Patch Antenna for Millimeter Wave Applications

Published:2023-01-27 Issue:3 Volume:12 Page:632
ISSN:2079-9292
Container-title:Electronics
language:en
Short-container-title:Electronics

Author:

Bogdan Grzegorz¹^ORCID,Sobolewski Jakub¹^ORCID,Bajurko Paweł¹^ORCID,Yashchyshyn Yevhen¹,Oklej Jan²,Ostaszewski Dariusz²

Affiliation:

1. Institute of Radioelectronics and Multimedia Technology, Warsaw University of Technology, Nowowiejska 15/19, 00-665 Warsaw, Poland

2. Łukasiewicz Research Network, Tele and Radio Research Institute, Ratuszowa 11, 03-450 Warsaw, Poland

Abstract

Wire bonds are one of the most common interconnects used in microelectronics; however, their application to millimeter wave monolithic microwave integrated circuits (MMICs) may severely decrease the overall system performance due to transmission loss, radiation loss, and impedance mismatch. The goal of this work was to optimize a wire-bonded patch antenna to minimize losses and maximize the gain in the frequency range from 81 to 83 GHz. Optimization was based on electromagnetic simulations of different variants of the wire bond. Results show that the optimized structure demonstrates two major advantages. Firstly, it does not require any external matching network; hence, it can be directly connected to a contact pad of an MMIC die. Secondly, the wire bond radiation effect is utilized to enhance the patch antenna gain at the broadside direction.

Funder

National Science Centre

Foundation for Polish Science

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering

Link

https://www.mdpi.com/2079-9292/12/3/632/pdf

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