Evaluation and Extraction of Equivalent Circuit Parameters for GSG-Type Bonding Wires Using Electromagnetic Simulator-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Evaluation and Extraction of Equivalent Circuit Parameters for GSG-Type Bonding Wires Using Electromagnetic Simulator

Published:2022-11-01 Issue:11 Volume:E105.C Page:692-695
ISSN:0916-8524
Container-title:IEICE Transactions on Electronics
language:en
Short-container-title:IEICE Trans. Electron.

Author:

HIRANO Takuichi¹

Affiliation:

1. Tokyo City University

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

https://www.jstage.jst.go.jp/article/transele/E105.C/11/E105.C_2021ESS0002/_pdf

Reference23 articles.

1. [1] O.L. Anderson, H. Christensen, and P. Andreatch, “Technique for connecting electrical leads to semiconductors,” J. Applied Physics, vol.28, no.8, p.923, 1957. (DOI: 10.1063/1.1722893). 10.1063/1.1722893

2. [2] P.H. Dehkordi and D.W. Bouldin, “Design for packageability-early consideration of packaging from a VLSI designer's viewpoint,” Computer, vol.26, no.4, pp.76-81, 1993. (DOI: 10.1109/2.206519). 10.1109/2.206519

3. [3] C.-T. Tsai, “Package inductance characterization at high frequencies,” IEEE Trans. Compon. Packaging Manuf. Technol.: Part B, vol.17, no.2, pp.175-181, 1994. (DOI: 10.1109/96.330432). 10.1109/96.330432

4. [4] H.-Y. Lee, “Wideband characterization of mutual coupling between high density bonding wires,” IEEE Microw. Guided Wave Lett., vol.4, no.8, pp.265-267, 1994. (DOI: 10.1109/75.311493). 10.1109/75.311493

5. [5] H.-Y. Lee, “Wideband characterization of a typical bonding wire for microwave and millimeter-wave integrated circuits,” IEEE Trans. Microw. Theory Tech., vol.43, no.1, pp.63-68, 1995. (DOI: 10.1109/22.363006). 10.1109/22.363006

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electromagnetic Simulation of Transmission Characteristics in Flip-Chip Bonding;2023 IEEE International Symposium On Antennas And Propagation (ISAP);2023-10-30

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3