Characterization of underfill materials for functional solder bumped flip chips on board applications
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx4/6144/16435/00759360.pdf?arnumber=759360
Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. System-in-Package (SiP);Semiconductor Advanced Packaging;2021
2. Recent Advances and New Trends in Flip Chip Technology;Journal of Electronic Packaging;2016-07-25
3. Analysis on Structural Stress of 64 × 64 InSb IRFPAs with Temperature Dependent Elastic Underfill;Journal of Sensors;2014
4. Effect of glass transition slope of underfill on solder joint fatigue life;2010 11th International Conference on Electronic Packaging Technology & High Density Packaging;2010-08
5. Recent advances in modeling the underfill process in flip-chip packaging;Microelectronics Journal;2007-01
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