Affiliation:
1. Fellow ASME ASM Pacific Technology, 16-22 Kung Yip Street, Kwai Chung, Hong Kong, China
Abstract
Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be presented in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended.
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Cited by
89 articles.
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