Component Model Calibration Using Transient Thermal Test Methods and Multiple Measurement Setups-Reference-Cited by-同舟云学术

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Component Model Calibration Using Transient Thermal Test Methods and Multiple Measurement Setups

Published:2019-09 Issue: Volume: Page:
ISSN:
Container-title:2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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Author:

Szoke Szilard,Koradi Zoltan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8911538/8923376/08923671.pdf?arnumber=8923671

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Applicability of JESD51-14 to clip-bonded, discrete power devices;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27

2. Finite element thermal modelling of power MOSFET packages;Microelectronics Reliability;2022-09

3. Optimization-Based Network Identification for Thermal Transient Measurements;Energies;2021-11-16

4. Thermal Fluid Simulation Modeling and Fatigue Analysis of Double-Sided Cooling Power Module Based on Thermal Transient Test;2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2021-09-23

5. FEM model calibration for simulation aided thermal design;Microelectronics Reliability;2021-03

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