Author:
Cioban R.,Szőke Sz.,Zaharie-B D.,Kórádi Z.,Leordean C.,Simon S.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Reliability assessment of power MOSFETs working in avalanche mode based on a thermal strain direct measurement approach;Russo,2016
2. Failure modes and FEM analysis of power electronic packaging;Ye;Finite Elem. Anal. Des.,2002
3. Reliability Analysis of Solder Joints Under Different Thermal and Thermo-mechanical Loading Conditions: Case Study of Automotive ECUs;Youssef,2016
4. Computational-efficient thermal estimation for IGBT modules under periodic power loss profiles in modular multilevel converters;Zhang;IEEE Trans. Ind. Appl.,2019
5. Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method;Amalu;Finite Elem. Anal. Des.,2015
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