Optimization-Based Network Identification for Thermal Transient Measurements

Author:

Ziegeler Nils J.ORCID,Nolte Peter W.ORCID,Schweizer StefanORCID

Abstract

Network identification by deconvolution is a proven method for determining the thermal structure function of a given device. The method allows to derive the thermal capacitances as well as the resistances of a one-dimensional thermal path from the thermal step response of the device. However, the results of this method are significantly affected by noise in the measured data, which is unavoidable to a certain extent. In this paper, a post-processing procedure for network identification from thermal transient measurements is presented. This so-called optimization-based network identification provides a much more accurate and robust result compared to approaches using Fourier or Bayesian deconvolution in combination with Foster-to-Cauer transformation. The thermal structure function obtained from network identification by deconvolution is improved by repeatedly solving the inverse problem in a multi-dimensional optimization process. The result is a non-diverging thermal structure function, which agrees well with the measured thermal impedance. In addition, the associated time constant spectrum can be calculated very accurately. This work shows the potential of inverse optimization approaches for network identification.

Publisher

MDPI AG

Subject

Energy (miscellaneous),Energy Engineering and Power Technology,Renewable Energy, Sustainability and the Environment,Electrical and Electronic Engineering,Control and Optimization,Engineering (miscellaneous)

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Tridiagonal Approaches for Network Identification by Deconvolution;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27

2. Accuracy Comparison of T3ster-Master and Optimization-based Network Identification;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27

3. Where did you come from and where are you heading to, thermal analysis of heating effects?;Journal of Thermal Analysis and Calorimetry;2023-04-06

4. Cooling Systems of Power Semiconductor Devices—A Review;Energies;2022-06-22

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3