Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions-Reference-Cited by-同舟云学术

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Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions

Published:2019-09 Issue: Volume: Page:
ISSN:
Container-title:2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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Author:

Langbauer Thomas,Mentin Christian,Rindler Michael,Vollmaier Franz,Connaughton Alexander,Krischan Klaus

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8911538/8923376/08923595.pdf?arnumber=8923595

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanism Segmentation Transient Model of SiC MOSFETs for Multi-rate Electro-thermal Simulation;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

2. Influence of Parasitic Elements and Operating Conditions of Semiconductor Switches on Power Losses and the Junction Temperature of These Switches;Energies;2023-08-04

3. Electro-Thermal Co-design of a High-Density Power-Stage for a Reconfigurable-Battery-Assisted Electric-Vehicle Fast-Charger using Multi-Physics Co-simulation and Topology Optimization;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19

4. Fast Method of Computations of Ripples in the Junction Temperature of Discrete Power SiC-MOSFETs at the Steady State;Applied Sciences;2022-09-05

5. Approximating the Steady-State Temperature of 3D Electronic Systems with Convolutional Neural Networks;Mathematical and Computational Applications;2022-01-14

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