Modeling and Experimental Study of the Kink Formation Process in Wire Bonding-Reference-Cited by-同舟云学术

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Modeling and Experimental Study of the Kink Formation Process in Wire Bonding

Published:2014-02 Issue:1 Volume:27 Page:51-59
ISSN:0894-6507
Container-title:IEEE Transactions on Semiconductor Manufacturing
language:
Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Wang Fuliang,Chen Yun,Han Lei

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/66/6729094/06338346.pdf?arnumber=6338346

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Low Height Wire bond Looping Technology using Wedge Bonding for the MMIC Package;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

3. Response Behavior of Typical Wire Looping under Random Vibration for Wire Bonding Packaging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

4. A Novel Panel Level Double Side Embedded Package for Small Size Power Devices;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

5. Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition;Journal of Electronic Packaging;2019-02-25

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