Response Behavior of Typical Wire Looping under Random Vibration for Wire Bonding Packaging-Reference-Cited by-同舟云学术

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Response Behavior of Typical Wire Looping under Random Vibration for Wire Bonding Packaging

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
language:
Short-container-title:

Author:

Dai Wenjie¹,Liu Junfu²,Liu Yunpeng²,Chen Taotao²,He Hu¹

Affiliation:

1. Central South University,State Key Laboratory of High Performance Complex Manufacturing. College of Mechanical and Electrical Engineering,Changsha,China,410083

2. 43rd Research Institute China Electronics Technology Group Corporation,Hefei,China,230031

Funder

National Natural Science Foundation of China

Innovation-Driven Project of Central South University

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873321.pdf?arnumber=9873321

Reference10 articles.

1. Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

2. Empirical Equation of Wire Sag Model for Semiconductor Packaging With Numerical and Experimental Verification

3. Modeling and Experimental Study of the Kink Formation Process in Wire Bonding

4. Simulation of bonding wire deformation in random vibration

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