Author:
Verbree Jouke,Marinissen Erik Jan,Roussel Philippe,Velenis Dimitrios
Cited by
19 articles.
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1. Yield-aware joint die packing, die matching and static thread mapping for hard real-time 3D embedded CMPs;Microprocessors and Microsystems;2022-07
2. Fabrication Cost Analysis for Contactless 3-D ICs;IEEE Transactions on Circuits and Systems II: Express Briefs;2019-05
3. Beyond the socket;Proceedings of the 50th Annual IEEE/ACM International Symposium on Microarchitecture;2017-10-14
4. Three-Stage Optimization of Pre-Bond Diagnosis of TSV Defects;Journal of Electronic Testing;2017-09-02
5. On the Restore Time Variations of Future DRAM Memory;ACM Transactions on Design Automation of Electronic Systems;2017-03-15