Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Cited by
17 articles.
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1. Research on Electroplating Bonding of Flip-Chip Under the Action of Additives;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-08
2. Future Trend of Advanced Thermal Management Materials;Advanced Thermal Management Materials;2012-07-27
3. Polymeric Microelectromechanical Millimeter Wave Systems;RF and Microwave Microelectronics Packaging;2009-10-30
4. Microfabrication;Fabrication and Design of Resonant Microdevices;2009
5. Development and investigation of horizontal elements in 3D micro-contacts and structures;2008 2nd Electronics Systemintegration Technology Conference;2008-09