Heterogeneous Integration Using Organic Interposer Technology-Reference-Cited by-同舟云学术

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Heterogeneous Integration Using Organic Interposer Technology

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Scott George J.,Bae JaeHun,Yang KiYeul,Ki WonMyoung,Whitchurch Nathan,Kelly Mike,Zwenger Curtis,Jeon JongHyun,Hwang TaeKyeong

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159245.pdf?arnumber=9159245

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Heterogeneous 3-D Integration of GaAs- and InP-Based Electronic-Photonic Devices Onto Si Using Multilayer Adhesive Die-To Wafer Bonding for Photonic-Radio Frequency Applications;IEEE Transactions on Electron Devices;2024-09

2. Micro-3D-Printed Packaging Substrates With Embedded Through Holes for Organic Interposers;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Structural Characterization of 2.5D System in Package Combined with High Bandwidth Memory for Enhanced Quality and Reliability;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. The HRDL Interposer Technology Using Metal/Polymer Hybrid Bonding and Its Characteristics;IEEE Transactions on Materials for Electron Devices;2024

5. Interconnects in a Multi-Layer Polymer-on-Si 50-GHz Packaging Technology;2023 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS);2023-10-25

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