Author:
Peng Chia-Yu,Lin Puru Bruce,Ko Cheng-Ta,Wang Chi-Wei,Chuang Oscar,Lee Chang-Chun
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The HRDL Interposer Technology Using Metal/Polymer Hybrid Bonding and Its Characteristics;IEEE Transactions on Materials for Electron Devices;2024
2. Transitive Closure Graph-Based Warpage-Aware Floorplanning for Package Designs;Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design;2022-10-30
3. Impact of warpage on signal delivery with large size FC-PBGA package;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
4. System-in-Package (SiP);Semiconductor Advanced Packaging;2021