Transitive Closure Graph-Based Warpage-Aware Floorplanning for Package Designs-Reference-Cited by-同舟云学术

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Transitive Closure Graph-Based Warpage-Aware Floorplanning for Package Designs

Published:2022-10-30 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design
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Author:

Hsu Yang¹,Chung Min-Hsuan¹,Chang Yao-Wen¹,Lin Ci-Hong²

Affiliation:

1. National Taiwan University, Taipei, Taiwan

2. CoreTech System Co., Ltd., Hsinchu, Taiwan

Funder

Ministry of Science and Technology, Taiwan

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3508352.3549354

Reference28 articles.

1. High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration;Liu C. C.;Proc. of IEEE IEDM,2012

2. D. Yang and S. Wegner. Apple watch series 3 teardown. Accessed: 2021-11-4. [Online]. Available: https://www.techinsights.com/zh-tw/node/16538 D. Yang and S. Wegner. Apple watch series 3 teardown. Accessed: 2021-11-4. [Online]. Available: https://www.techinsights.com/zh-tw/node/16538

3. C. Hou , " TSMC ecosystem for innovation," TSMC Symposium , presentation slides , August 2020 . C. Hou, "TSMC ecosystem for innovation," TSMC Symposium, presentation slides, August 2020.

4. Analysis of Bi-Metal Thermostats

5. Interfacial Stresses in Bimetal Thermostats

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