Coupled thermal-mechanical simulation methodology to estimate BGA reliability of 2.5D Packages
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159264.pdf?arnumber=9159264
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions;Materials;2023-06-09
2. Finite element analysis of underfill effect on the CBGA package reliability under thermal cycling;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
3. Optimal thermo-mechanical reliability design of 2.5D lidless package;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
4. Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-02
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