High Frequency Characteristics of Glass Interposer-Reference-Cited by-同舟云学术

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High Frequency Characteristics of Glass Interposer

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Tanaka Masaya,Kuramochi Satoru,Tai Takahiro,Sato Yoichiro,Kidera Nobutaka

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159335.pdf?arnumber=9159335

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ultrahigh Aspect Ratio Through Glass Vias Perforation Utilizing Selective Laser‐Induced Etching with Nanochannels;Advanced Engineering Materials;2024-06-08

2. Experimental study of transmission signal performance of sub-2 micron fine-wiring with novel structure;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. On Hardware Security and Trust for Chiplet-Based 2.5D and 3D ICs: Challenges and Innovations;IEEE Access;2024

4. Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging;Sensors;2023-12-28

5. TGV through-hole double-sided electroplated copper filling mode regulation and process reliability test study;SCIENTIA SINICA Chimica;2023-09-01

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