Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging
Author:
Yu Chen1, Wu Shaocheng1, Zhong Yi1, Xu Rongbin1ORCID, Yu Tian1, Zhao Jin2, Yu Daquan1ORCID
Affiliation:
1. School of Electronic Science and Engineering, Xiamen University, Xiamen 361005, China 2. Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing 100021, China
Abstract
Glass has emerged as a highly versatile substrate for various sensor and MEMS packaging applications, including electromechanical, thermal, optical, biomedical, and RF devices, due to its exceptional properties such as high geometrical tolerances, outstanding heat and chemical resistance, excellent high-frequency electrical properties, and the ability to be hermetically sealed. In these applications, Through Glass Via (TGV) technology plays a vital role in manufacturing and packaging by creating electrical interconnections through glass substrates. This paper provides a comprehensive summary of the research progress in TGV fabrication along with its integrations, including through via formation and metallization. This paper also reviews the significant qualification and reliability achievements obtained by the scientific community for TGV technology. Additionally, this paper summarizes the application of TGV technology in various sensors such as MEMS sensors and discusses the potential applications and future development directions of TGV technology.
Funder
National Natural Science Foundation of China
Subject
Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry
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