Author:
Chen C. C.,Chen K. H.,Wu Y. S.,Tsao P. H.,Leu S. T.
Cited by
7 articles.
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1. Fan-out PoP Solder Joint Reliability Investigation by System Power Cycling;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Aging Behaviour and Environmental Impact of Under Bump Metallurgies for Wafer Level Balling;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Fan-In Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
4. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
5. A Parameter Study for the Design Optimization to Relieve Pattern Stress of PCB under the Temperature Cycling Condition;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05