From 2D-planar to 3D-non-planar device architecture: A scalable path forward?-Reference-Cited by-同舟云学术

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From 2D-planar to 3D-non-planar device architecture: A scalable path forward?

Published:2013-09 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the IEEE 2013 Custom Integrated Circuits Conference
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Author:

Shahidi Ghavam G.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6648471/6658393/06658477.pdf?arnumber=6658477

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and Performance Analysis of 3-Fin 08 nm Physical Gate Length SOI FinFETs Employing Gate Stacked High-K Dielectrics;2023 IEEE 3rd International Conference on Applied Electromagnetics, Signal Processing, & Communication (AESPC);2023-11-24

2. A General Design Strategy for Block Copolymer Directed Self-Assembly Patterning of Integrated Circuits Contact Holes using an Alphabet Approach;Nano Letters;2015-01-08

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