Author:
Watanabe Naoya,Mori Takamichi,Asano Tanemasa
Cited by
3 articles.
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1. Micro-Interconnection(Japan Institute of Electronics Packaging);JOURNAL OF THE JAPAN WELDING SOCIETY;2013
2. Compliant bump technology for back-side illuminated CMOS image sensor;2009 59th Electronic Components and Technology Conference;2009-05
3. 10.5104/jiep.12.606;Journal of Japan Institute of Electronics Packaging;2009