Compliant bump technology for back-side illuminated CMOS image sensor-Reference-Cited by-同舟云学术

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Compliant bump technology for back-side illuminated CMOS image sensor

Published:2009-05 Issue: Volume: Page:
ISSN:
Container-title:2009 59th Electronic Components and Technology Conference
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Author:

Asano Tanemasa,Watanabe Naoya,Isao Tsunoda ,Yasuhiro Kimiya ,Katsuaki Fukunaga ,Minoru Handa ,Hiroki Arao ,Yasuhiro Yamaji ,Masahiro Aoyagi ,Takao Higashimachi ,Koichiro Tanaka ,Takayuki Takao ,Kimiharu Matsumura ,Akihiro Ikeda ,Yukinori Kuroki ,Toshio Tsurushima

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5066986/5073977/05073994.pdf?arnumber=5073994

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Pixel-Parallel 3-D Integrated CMOS Image Sensors With Pulse Frequency Modulation A/D Converters Developed by Direct Bonding of SOI Layers;IEEE Transactions on Electron Devices;2015-11

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