Application of IEEE-370 for PCIe Interconnect Test with 2X-Thru De-embedding

Author:

Moon Se-Jung,Ye Xiaoning,Wang Kai A.,Khan Umair I.,Wig Timothy

Publisher

IEEE

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Fixture De-Embedding Challenges for Short 2xThru Structure;2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2023-12-12

2. Measurement-Based Modeling of PCB-to-Coaxial Cable Transition for 3D Electromagnetic Simulation by Equivalent Circuit Assisted De-Embedding;2022 International Symposium on Electromagnetic Compatibility – EMC Europe;2022-09-05

3. A Protocol Layer Test Strategy of Interlaken Embedded in FPGA;2022 IEEE 10th Joint International Information Technology and Artificial Intelligence Conference (ITAIC);2022-06-17

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