1. Die thickness impact on thermo-mechanical stress in 3D packages
2. Constriction/Spreading Resistance Model for Electronic Packaging;lee;Proceedings of ASME/JSME Engineering Conference,1995
3. Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages
4. Power and thermal challenges in mobile devices
5. A Comparison of the Cooling. Efficiency of Popular Tablets in a. Natural Convection Environment;wagner;Advancements In Thermal Management,2014