Author:
Salahouelhadj A.,Gonzalez M.,Oprins H.
Cited by
2 articles.
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1. Reliable Aluminum Wire-Bonded SiC/Si Diodes With Laminated Al/Cu Stress Buffers;IEEE Transactions on Power Electronics;2022-09
2. Package level thermal analysis of backside power delivery network (BS-PDN) configurations;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31