The Optimal Solution of Reflow Oven Recipe based on Physics-guided Machine Learning Model
Author:
Affiliation:
1. The State University of New York at Binghamton,Department of Mechanical Engineering,Binghamton,NY,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899644.pdf?arnumber=9899644
Reference26 articles.
1. Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process
2. Temperature prediction for system in package assembly during the reflow soldering process
3. Modelling of temperature distribution along PCB thickness in different substrates during reflow
4. MODELING AND OPTIMIZATION OF REFLOW THERMAL PROFILING OPERATION: A COMPARATIVE STUDY
5. Noncontact Reflow Oven Thermal Profile Prediction Based on Artificial Neural Network
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